Semiconductor Industry Weekly

Semiconductor Industry Weekly #1: TSMC Capacity Crunch, H200 Policy Chaos, and the ASIC Duopoly

TSMC's 2nm and 3nm lines are fully booked through 2027, the H200 export framework is structurally contradictory, Intel EMIB gains hyperscaler design wins as CoWoS overflows, and Broadcom plus Marvell now control 80%+ of custom AI chip design.