10 月 4 日—5 日:日本第一次用贴片机完成博通 102.4T 光电融合交换机的实装评估、并交出一台面向先进半导体的不良解析设备,美国把 18A 的至强 6+ 从超大规模客户放开给更广的厂商,这两天三地都没有新的公司融资或新股。
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nikkei.com
m.21jingji.com
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renaissancecapital.com
jpx.co.jp
finance.sina.cn
atpress.ne.jp
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