
A combined two-day edition covering May 7–9. The lead story is the Wall Street Journal's confirmed preliminary agreement between Apple and Intel for Intel to manufacture entry-level M-series chips on the 18A-P node (2027 timeline) — the first break in TSMC's decade-long exclusive hold on Apple's advanced silicon. Supporting items: Gurman's AirPods cameras DVT milestone and AI pendant wearable reveal; iPhone 18 Pro A20 Pro 2nm + WMCM chip details; iOS 27 Camera Siri mode and Photos AI editing (Extend, Enhance, Reframe); iOS 26.5 RC 2 build 23F77 ahead of next-week public launch; MacBook Neo production doubling with risk to the $599 entry tier; Apple Watch Series 12 and watchOS 27 overview; and a long-horizon Spatial iPhone holographic display rumor (2030 timeframe, context-only). Most tracked leakers remain silent — consistent with pre-WWDC pattern.

appleinsider.com
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