09:00窗口：台积电董事会与索尼合资两条事件 (2026)

[
  {
    "event_id": "tsmc-tw-20260811-board-capex-q2",
    "title": "台积电董事会批准294.425亿美元资本拨款",
    "event_time_utc": null,
    "event_time_quality": "day_only",
    "published_at_utc": "2026-08-11T00:00:00Z",
    "event_type": "capex",
    "asset_keys": ["SEMICONDUCTOR"],
    "direction_score": {"SEMICONDUCTOR": 2},
    "confidence": 96,
    "horizon": "weeks",
    "raw_facts": {
      "announcement_date": "2026-08-11",
      "q2_consolidated_revenue": {
        "actual": "NT$1,270.38 billion",
        "consensus": "原文未披露",
        "prior": "原文未披露"
      },
      "q2_net_income": {
        "actual": "NT$706.56 billion",
        "consensus": "原文未披露",
        "prior": "原文未披露"
      },
      "q2_diluted_eps": {
        "actual": "NT$27.25",
        "consensus": "原文未披露",
        "prior": "原文未披露"
      },
      "q2_cash_dividend_per_share": {
        "actual": "NT$7.0 per share",
        "consensus": "原文未披露",
        "prior": "原文未披露"
      },
      "board_approved_capital_appropriations": {
        "actual": "approximately US$29,442.50 million",
        "consensus": "原文未披露",
        "prior": "原文未披露"
      },
      "capital_appropriation_uses": [
        "advanced technology capacity",
        "advanced packaging, mature and specialty capacity",
        "fab construction and facility systems"
      ]
    },
    "transmission_chain": "董事会批准约294.425亿美元资本拨款→先进制程、先进封装及成熟/特色产能建设需求增加→晶圆代工与半导体设备产业链订单预期改善→SEMICONDUCTOR定价获得支撑。",
    "invalidation_conditions": "若台积电后续公告取消或大幅削减该资本拨款，或实际资本支出显著低于批准金额且下调先进制程、先进封装或厂房建设计划，本事件对SEMICONDUCTOR的正向判断作废。",
    "source_urls": [
      "https://pr.tsmc.com/english/news/3332",
      "https://www.sec.gov/Archives/edgar/data/1046179/000104617926000536/tsm-boardx20260811.htm"
    ],
    "source_tier": "A"
  },
  {
    "event_id": "tsmc-sony-jp-20260811-image-sensor-jv-confirmed",
    "title": "台积电与索尼签署图像传感器合资最终协议",
    "event_time_utc": null,
    "event_time_quality": "day_only",
    "published_at_utc": "2026-08-11T00:00:00Z",
    "event_type": "capacity_plan",
    "asset_keys": ["SEMICONDUCTOR"],
    "direction_score": {"SEMICONDUCTOR": 1},
    "confidence": 96,
    "horizon": "weeks",
    "raw_facts": {
      "announcement_date": "2026-08-11",
      "joint_venture": "Sony Semiconductor Solutions与TSMC签署Advanced Vision Semiconductor Manufacturing Corporation具有法律约束力的最终协议，在日本熊本县合志市设立图像传感器合资公司。",
      "planned_volume_production": {
        "actual": "2029年开始量产",
        "consensus": "原文未披露",
        "prior": "2029年量产（此前报道）"
      },
      "sony_planned_contribution": {
        "actual": "approximately 465 billion yen，现金出资与资产转移相结合",
        "consensus": "原文未披露",
        "prior": "此前报道约1万亿日元项目规模，Sony持股60%"
      },
      "tsmc_planned_cash_contribution": {
        "actual": "approximately 282 billion yen",
        "consensus": "原文未披露",
        "prior": "此前报道TSMC持股40%"
      },
      "control_and_conditions": "Sony为唯一控股股东，合资公司计划并入Sony集团；交易须取得监管批准并满足其他惯常交割条件。",
      "supersedes_event_id": "reuters-global-20260810-sony-tsmc-image-sensor-capex"
    },
    "transmission_chain": "Sony与TSMC签署最终协议并确认分期出资→日本熊本先进图像传感器产能建设与TSMC先进制程制造需求明确→传感器晶圆及相关设备的中期需求预期改善→SEMICONDUCTOR获得边际支撑。",
    "invalidation_conditions": "若监管审批未通过、交易未完成，或双方后续取消合资、下调出资与2029年量产计划，本事件对SEMICONDUCTOR的正向判断作废。",
    "source_urls": [
      "https://pr.tsmc.com/english/news/3333",
      "https://www.sony-semicon.com/en/news/2026/2026081101.html"
    ],
    "source_tier": "A"
  }
]
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